[6198PC Stock]
- Nimewo Pati:
- BGM123N256V1
- Manifakti:
- Silicon Labs
- Detaye deskripsyon:
- BGM123 BLUETOOTH SIP MODULE 3 D. Bluetooth Modules (802.15.1)
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: RFID Reader Modules, RF Pwodwi pou Telefòn, Balun, RF Front End (LNA + PA), RF Direksyon koupleur, RFI ak EMI - Kontak, Fingerstock ak jwen, RF kontwolè pouvwa ICS and RF Demodulators ...
- Avantaj konpetitif:
- We specialize in Silicon Labs BGM123N256V1 electronic components. BGM123N256V1 can be shipped within 24 hours after order. If you have any demands for BGM123N256V1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BGM123N256V1 Atribi pwodwi yo
Nimewo Pati :
BGM123N256V1
Manifakti :
Silicon Labs
Deskripsyon :
BGM123 BLUETOOTH SIP MODULE 3 D
Seri :
-
Estati Pati :
Obsolete
RF Fanmi / Creole :
Bluetooth
Pwotokòl :
Bluetooth v4.2
Modilasyon :
GFSK
Frekans :
2.4GHz
To Done :
1Mbps
Pouvwa - Sòti :
8dBm
Sansiblite :
-90dBm
Interfaces seri :
I²C, I²S, SPI, UART
Kalite Antèn :
Integrated, Chip
Itilize IC / Pati :
EFR32BG
Size memwa :
256kB Flash, 32kB RAM
Voltage - Pwovizyon pou :
1.85V ~ 3.8V
Kouran - Resevwa :
9mA
Kouran - transmèt :
8.2mA
Mounting Kalite :
Surface Mount
Operating Tanperati :
-40°C ~ 85°C
Pake / Ka :
56-SMD Module
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