HFA2.00CL25 Pricing (USD) [1773PC Stock]
- 1 pcs$24.41591
- Nimewo Pati:
- HFA2.00CL25
- Manifakti:
- Techflex
- Detaye deskripsyon:
- TAPE HOT FUSION CLR 1.97X 8.3YD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Distribitè Tape yo, Pwodwi pou Telefòn, Fim, Lakòl, adezif, aplikatè, Materyèl 2D and Tep ...
- Avantaj konpetitif:
- We specialize in Techflex HFA2.00CL25 electronic components. HFA2.00CL25 can be shipped within 24 hours after order. If you have any demands for HFA2.00CL25, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HFA2.00CL25 Atribi pwodwi yo
Nimewo Pati :
HFA2.00CL25
Manifakti :
Techflex
Deskripsyon :
TAPE HOT FUSION CLR 1.97X 8.3YD
Seri :
Shrinkflex®
Estati Pati :
Active
Kalite Tep :
Hot Fusion
Adezif :
-
Fè bak, Carrier :
-
Pesè :
0.0120" (12.0 mils, 0.305mm)
Pesè - adezif :
-
Pesè - Fè bak, Carrier :
-
Lajè :
1.97" (50.00mm)
Longè :
25' (7.6m) 8.3 yds
Koulè :
Clear
Itilizasyon :
-
Tanperati Range :
-
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