335214B00032G Pricing (USD) [52890PC Stock]
- 1 pcs$0.73928
- 5,400 pcs$0.63770
- Nimewo Pati:
- 335214B00032G
- Manifakti:
- Aavid, Thermal Division of Boyd Corporation
- Detaye deskripsyon:
- BGA HEAT SINK. Heat Sinks BGA Extruded Heatsink, Bi-Directional, Black Anodized, 25x25x10mm, IC Pkg Size = 25 x 25, Metal, Tape #32
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: DC Fans, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra, Fanatik AC, Fanatik - Pwodwi pou Telefòn and Tèmik - tèrmoelèktrik, asanble Peltier ...
- Avantaj konpetitif:
- We specialize in Aavid, Thermal Division of Boyd Corporation 335214B00032G electronic components. 335214B00032G can be shipped within 24 hours after order. If you have any demands for 335214B00032G, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
335214B00032G Atribi pwodwi yo
Nimewo Pati :
335214B00032G
Manifakti :
Aavid, Thermal Division of Boyd Corporation
Deskripsyon :
BGA HEAT SINK
Seri :
-
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Fòm :
Square, Fins
Longè :
0.985" (25.02mm)
Lajè :
0.985" (25.02mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.390" (9.91mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
5.30°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
10.00°C/W
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Ou ka enterese tou
-
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-
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BOARD LEVEL HEAT SINK. Heat Sinks Square Basket Style Board Level Heatsink for TO-3, Slanted Vane Fins, Horizontal Mounting, 6.2 n Thermal Resistance, Black Anodized, 19.05mm
-
TXB2P032037B
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THERMAL LINK PRESSON BLK TO-5. Heat Sinks TO-5 4-40 screw mt.
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