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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Fanatik, tèmik Jesyon
  4. Tèmik - Kousinen, Dra
  5. SP2000-0.015-00-1212

Bergquist - SP2000-0.015-00-1212

KEY Part #: K6149355

SP2000-0.015-00-1212 Pricing (USD) [485PC Stock]

  • 1 pcs$95.58173
Nimewo Pati:
SP2000-0.015-00-1212
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 304.8MMX304.8MM WHITE. Thermal Interface Products BERGQUIST SIL PAD TSP 3500
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - lavabo yo, Tèmik - Likid Refwadisman, Fanatik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra, Fanatik AC and DC Fans ...
Avantaj konpetitif:
We specialize in Bergquist SP2000-0.015-00-1212 electronic components. SP2000-0.015-00-1212 can be shipped within 24 hours after order. If you have any demands for SP2000-0.015-00-1212, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP2000-0.015-00-1212 Atribi pwodwi yo

Nimewo Pati : SP2000-0.015-00-1212
Manifakti : Bergquist
Deskripsyon : THERM PAD 304.8MMX304.8MM WHITE
Seri : Sil-Pad® 2000
Estati Pati : Active
Itilizasyon : -
Kalite : Insulator Pad, Sheet
Fòm : Square
Deskripsyon : 304.80mm x 304.80mm
Pesè : 0.0150" (0.381mm)
Materyèl : Silicone Elastomer
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : White
Rezistivite tèmik : -
Konductivite tèmik : 3.5 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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