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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 514-83-357M19-001148

Preci-Dip - 514-83-357M19-001148

KEY Part #: K3342731

514-83-357M19-001148 Pricing (USD) [1069PC Stock]

  • 1 pcs$40.72437
  • 21 pcs$40.52176
Nimewo Pati:
514-83-357M19-001148
Manifakti:
Preci-Dip
Detaye deskripsyon:
CONN SOCKET BGA 357POS GOLD.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konektè LGH, Konnektè memwa - Kat PC - Cartes, Tèminal blòk - Fil Komisyon Konsèy la, D-Sub, D-ki gen fòm Connectors - Pwodwi pou Telefò, Konnektè Konnen - Pwodwi pou Telefòn, Kalite Konnektè Power Connection - Housings, Kat Edge Connectors - Edgeboard Connectors and Bannann ak Ide Konektè - adaptè ...
Avantaj konpetitif:
We specialize in Preci-Dip 514-83-357M19-001148 electronic components. 514-83-357M19-001148 can be shipped within 24 hours after order. If you have any demands for 514-83-357M19-001148, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

514-83-357M19-001148 Atribi pwodwi yo

Nimewo Pati : 514-83-357M19-001148
Manifakti : Preci-Dip
Deskripsyon : CONN SOCKET BGA 357POS GOLD
Seri : 514
Estati Pati : Active
Kalite : BGA
Nimewo nan pozisyon oswa Pins (gri) : 357 (19 x 19)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 29.5µin (0.75µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Surface Mount
Karakteristik : Open Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : -
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Tanperati : -55°C ~ 125°C
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