Nimewo Pati :
BGM12LBA9E6327XTSA1
Manifakti :
Infineon Technologies
Deskripsyon :
MULTI CHIP MODULES
RF Fanmi / Creole :
Bluetooth
Pwotokòl :
802.11a/b/g/n, Bluetooth v4.0
Modilasyon :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frekans :
703MHz ~ 960MHz
Interfaces seri :
SPI, USB
Voltage - Pwovizyon pou :
1.6V ~ 3.1V
Mounting Kalite :
Surface Mount
Operating Tanperati :
-40°C ~ 85°C