Xilinx Inc. - XCZU17EG-3FFVD1760E

KEY Part #: K1302401

[9PC Stock]


    Nimewo Pati:
    XCZU17EG-3FFVD1760E
    Manifakti:
    Xilinx Inc.
    Detaye deskripsyon:
    IC FPGA 308 I/O 1760FCBGA.
    Manufacturer's standard lead time:
    Nan stok
    Lavi etajè:
    Yon ane
    Chip Soti nan:
    Hong Kong
    RoHS:
    Metòd peman:
    Chemen chajman:
    Kategori Fanmi yo:
    KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Akizisyon Done - Analog pou Digital Convertisseurs, Lineyè - Anplifikatè - Audio, Lojik - FIFOs memwa, Lineyè - Anplifikatè - Amps Videyo ak Modil yo, Embedded - Sistèm Sou Chip (SoC), Revèy / Distribisyon - Minis pwogramasyon ak osila, PMIC - Chofè Gate and Entèfas - Chofè, Récepteurs, Transceivers ...
    Avantaj konpetitif:
    We specialize in Xilinx Inc. XCZU17EG-3FFVD1760E electronic components. XCZU17EG-3FFVD1760E can be shipped within 24 hours after order. If you have any demands for XCZU17EG-3FFVD1760E, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    XCZU17EG-3FFVD1760E Atribi pwodwi yo

    Nimewo Pati : XCZU17EG-3FFVD1760E
    Manifakti : Xilinx Inc.
    Deskripsyon : IC FPGA 308 I/O 1760FCBGA
    Seri : Zynq® UltraScale+™ MPSoC EG
    Estati Pati : Active
    Achitèk : MCU, FPGA
    Nwayo Processeur : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Flash Size : -
    Gwosè RAM : 256KB
    Periferik : DMA, WDT
    Koneksyon : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Vitès : 600MHz, 667MHz, 1.5GHz
    Prim Attributes : Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
    Operating Tanperati : 0°C ~ 100°C (TJ)
    Pake / Ka : 1760-BBGA, FCBGA
    Pake Aparèy Founisè : 1760-FCBGA (42.5x42.5)