Bergquist - Q3-0.005-00-22

KEY Part #: K6153738

Q3-0.005-00-22 Pricing (USD) [2493904PC Stock]

  • 1 pcs$0.02170
  • 6,000 pcs$0.02159

Nimewo Pati:
Q3-0.005-00-22
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 15.87MMX5.08MM BLACK. Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Series
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, Tèmik - lavabo yo, Tèmik - Likid Refwadisman and DC Fans ...
Avantaj konpetitif:
We specialize in Bergquist Q3-0.005-00-22 electronic components. Q3-0.005-00-22 can be shipped within 24 hours after order. If you have any demands for Q3-0.005-00-22, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

Q3-0.005-00-22 Atribi pwodwi yo

Nimewo Pati : Q3-0.005-00-22
Manifakti : Bergquist
Deskripsyon : THERM PAD 15.87MMX5.08MM BLACK
Seri : Q-Pad® 3
Estati Pati : Active
Itilizasyon : DO-4
Kalite : Pad, Sheet
Fòm : Round
Deskripsyon : 15.87mm x 5.08mm
Pesè : 0.0050" (0.127mm)
Materyèl : Elastomer
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : Black
Rezistivite tèmik : 0.35°C/W
Konductivite tèmik : 2.0 W/m-K

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