[6806PC Stock]
- Nimewo Pati:
- XR2D-2401-N
- Manifakti:
- Omron Electronics Inc-EMC Div
- Detaye deskripsyon:
- CONN IC DIP SOCKET 24POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Barik - Pwodwi pou Telefòn, Keystone - Pwodwi pou Telefòn, Modilè Konektè - Pwodwi pou Telefòn, Terminals - Connector Kouto, Tèminal blòk - Modil Entèfas, Sistèm Junction Tèminal yo, Blòk Tèminal - Blòk Baryè and Konnektè memwa - Kat PC Sockets ...
- Avantaj konpetitif:
- We specialize in Omron Electronics Inc-EMC Div XR2D-2401-N electronic components. XR2D-2401-N can be shipped within 24 hours after order. If you have any demands for XR2D-2401-N, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
XR2D-2401-N Atribi pwodwi yo
Nimewo Pati :
XR2D-2401-N
Manifakti :
Omron Electronics Inc-EMC Div
Deskripsyon :
CONN IC DIP SOCKET 24POS GOLD
Seri :
XR2
Estati Pati :
Obsolete
Kalite :
DIP, 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
24 (2 x 12)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
29.5µin (0.75µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Carrier
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
29.5µin (0.75µm)
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Polybutylene Terephthalate (PBT), Glass Filled
Operating Tanperati :
-55°C ~ 125°C
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