2292BG Pricing (USD) [19414PC Stock]
- 1 pcs$2.15687
- 5,000 pcs$2.14614
- Nimewo Pati:
- 2292BG
- Manifakti:
- Aavid, Thermal Division of Boyd Corporation
- Detaye deskripsyon:
- BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for Leadless Chip Carriers, Flat Packs and 68 Position, Radial Fin Round, Horizontal/Vertical Mounting, 28.58x28.58x9.14mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - lavabo yo, Tèmik - Kousinen, Dra, Tèmik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - adezif, epoksi, grès, kole and DC Fans ...
- Avantaj konpetitif:
- We specialize in Aavid, Thermal Division of Boyd Corporation 2292BG electronic components. 2292BG can be shipped within 24 hours after order. If you have any demands for 2292BG, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
2292BG Atribi pwodwi yo
Nimewo Pati :
2292BG
Manifakti :
Aavid, Thermal Division of Boyd Corporation
Deskripsyon :
BOARD LEVEL HEAT SINK
Seri :
-
Estati Pati :
Active
Kalite :
Board Level
Pake refwadi :
BGA
Metòd Atachman :
Thermal Tape, Adhesive (Not Included)
Fòm :
Cylindrical
Longè :
-
Lajè :
-
Dyamèt :
0.300" (7.62mm) ID, 1.125" (28.57mm) OD
Wotè Off Sèvi (Tay nan Fin) :
-
Disipasyon pouvwa @ monte tanperati :
1.5W @ 40°C
Rezistans tèmik @ fòse Air koule :
8.00°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
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