Nimewo Pati :
SMDSW.031 1LB
Manifakti :
Chip Quik Inc.
Deskripsyon :
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Konpozisyon :
Sn63Pb37 (63/37)
Pwen fizyon :
361°F (183°C)
Kalite Flux :
No-Clean, Water Soluble
Fil Kalib :
20 AWG, 22 SWG
Fòm :
Spool, 1 lb (454 g)
Tanperati Depo / Refrijerasyon :
-