Microsemi Corporation - APTGT30H170T3G

KEY Part #: K6533014

APTGT30H170T3G Pricing (USD) [1650PC Stock]

  • 1 pcs$26.24539
  • 100 pcs$26.09143

Nimewo Pati:
APTGT30H170T3G
Manifakti:
Microsemi Corporation
Detaye deskripsyon:
IGBT MOD TRENCH FULL BRIDGE SP3.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
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Avantaj konpetitif:
We specialize in Microsemi Corporation APTGT30H170T3G electronic components. APTGT30H170T3G can be shipped within 24 hours after order. If you have any demands for APTGT30H170T3G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

APTGT30H170T3G Atribi pwodwi yo

Nimewo Pati : APTGT30H170T3G
Manifakti : Microsemi Corporation
Deskripsyon : IGBT MOD TRENCH FULL BRIDGE SP3
Seri : -
Estati Pati : Active
Kalite IGBT : Trench Field Stop
Nou konte genyen : Full Bridge Inverter
Voltage - Pèseptè ki emèt deba (Max) : 1700V
Kouran - Pèseptè (Ic) (Max) : 45A
Pouvwa - Max : 210W
Vce (sou) (Max) @ Vge, Ic : 2.4V @ 15V, 30A
Kouran - Cutoff Pèseptè (Max) : 250µA
Antre kapasite (Cies) @ Vce : 2.5nF @ 25V
Antre : Standard
NTC thermistor : Yes
Operating Tanperati : -40°C ~ 150°C (TJ)
Mounting Kalite : Chassis Mount
Pake / Ka : SP3
Pake Aparèy Founisè : SP3