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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 374724B60024G

Aavid, Thermal Division of Boyd Corporation - 374724B60024G

KEY Part #: K6265289

374724B60024G Pricing (USD) [14255PC Stock]

  • 1 pcs$2.89099
Nimewo Pati:
374724B60024G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEATSINK BGA W/O SOLDER ANCHORS. Heat Sinks BGA Solder Anchor, 35x35x18mm, Black Anodized, 2 Anchors, IC Pkg Size = 35 x 35
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - lavabo yo, Tèmik - adezif, epoksi, grès, kole, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Pwodwi pou Telefòn, Fanatik AC, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole and Fanatik - Pwodwi pou Telefòn - Fil Fan ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 374724B60024G electronic components. 374724B60024G can be shipped within 24 hours after order. If you have any demands for 374724B60024G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

374724B60024G Atribi pwodwi yo

Nimewo Pati : 374724B60024G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK BGA W/O SOLDER ANCHORS
Seri : -
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Solder Anchor
Fòm : Square, Pin Fins
Longè : 1.378" (35.00mm)
Lajè : 1.378" (35.00mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.709" (18.00mm)
Disipasyon pouvwa @ monte tanperati : 3.0W @ 50°C
Rezistans tèmik @ fòse Air koule : 5.20°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 15.30°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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