Advanced Thermal Solutions Inc. - ATS-X50190G-C1-R0

KEY Part #: K6263760

ATS-X50190G-C1-R0 Pricing (USD) [5452PC Stock]

  • 1 pcs$7.57123
  • 10 pcs$7.15256
  • 25 pcs$6.73196
  • 50 pcs$6.31118

Nimewo Pati:
ATS-X50190G-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
SUPERGRIP HEATSINK 19X19X12.5MM. Heat Sinks maxiFLOW superGRIP BGA Heatsink, T766, Blue-Anodized, 18.25x18.25x12.5mm
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, Tèmik - lavabo yo and DC Fans ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-X50190G-C1-R0 electronic components. ATS-X50190G-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X50190G-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X50190G-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-X50190G-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : SUPERGRIP HEATSINK 19X19X12.5MM
Seri : maxiFLOW, superGRIP™
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Angled Fins
Longè : 0.748" (19.00mm)
Lajè : 0.748" (19.00mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.492" (12.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 10.20°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Blue Anodized

Ou ka enterese tou
  • 510-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • 122258

    Wakefield-Vette

    HEATSINK 15817 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 15817, 12x7.38x3.1 Inch

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-76.2-25.4-0.07-1A

    t-Global Technology

    PH3N NANO 76.2X25.4X0.07MM.