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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 374124B00035G

Aavid, Thermal Division of Boyd Corporation - 374124B00035G

KEY Part #: K6265296

374124B00035G Pricing (USD) [15205PC Stock]

  • 1 pcs$2.71030
Nimewo Pati:
374124B00035G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEATSINK BGA W/ADHESIVE TAPE. Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 23x23x18mm, IC Pkg Size = 23 x 23, Tape #35
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Pwodwi pou Telefòn, Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - tèrmoelèktrik, asanble Peltier ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 374124B00035G electronic components. 374124B00035G can be shipped within 24 hours after order. If you have any demands for 374124B00035G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

374124B00035G Atribi pwodwi yo

Nimewo Pati : 374124B00035G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK BGA W/ADHESIVE TAPE
Seri : -
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Thermal Tape, Adhesive (Included)
Fòm : Square, Pin Fins
Longè : 0.906" (23.01mm)
Lajè : 0.906" (23.01mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.709" (18.00mm)
Disipasyon pouvwa @ monte tanperati : 2.0W @ 50°C
Rezistans tèmik @ fòse Air koule : 7.40°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 23.40°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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