808-AG11D-LF Pricing (USD) [60727PC Stock]
- 1 pcs$0.64387
- Nimewo Pati:
- 808-AG11D-LF
- Manifakti:
- TE Connectivity AMP Connectors
- Detaye deskripsyon:
- CONN IC DIP SOCKET 8POS GOLD. IC & Component Sockets DIP .3CL 08P S/M OFRM AU/SN
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Terminals - Foil Connectors, Tèminal blòk - Din Rail, Chèn, Konèkteur Backplane - Kontak, Terminals - Ring Connectors, USB, DVI, koneksyon HDMI - Pwodwi pou Telefòn, Kalite Connectors Pouvwa Kalite - Pwodwi pou Telef, Terminals - May Connectors Fil and Konektè rektangilè - bag Komisyon Konsèy, anpileur ...
- Avantaj konpetitif:
- We specialize in TE Connectivity AMP Connectors 808-AG11D-LF electronic components. 808-AG11D-LF can be shipped within 24 hours after order. If you have any demands for 808-AG11D-LF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
808-AG11D-LF Atribi pwodwi yo
Nimewo Pati :
808-AG11D-LF
Manifakti :
TE Connectivity AMP Connectors
Deskripsyon :
CONN IC DIP SOCKET 8POS GOLD
Seri :
800
Estati Pati :
Active
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
8 (2 x 4)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
25.0µin (0.63µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
25.0µin (0.63µm)
Kontakte Materyèl - Post :
Copper
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Tanperati :
-55°C ~ 105°C
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