Advanced Thermal Solutions Inc. - ATS-H1-35-C2-R0

KEY Part #: K6264031

ATS-H1-35-C2-R0 Pricing (USD) [6155PC Stock]

  • 1 pcs$6.27997
  • 10 pcs$5.93226
  • 25 pcs$5.58349
  • 50 pcs$5.23446
  • 100 pcs$4.88551
  • 250 pcs$4.53653
  • 500 pcs$4.44929
  • 1,000 pcs$4.36205

Nimewo Pati:
ATS-H1-35-C2-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
HEATSINK 36.83X57.6X5.84MM T766.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, Fanatik AC, DC Fans, Tèmik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Kousinen, Dra, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-H1-35-C2-R0 electronic components. ATS-H1-35-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-35-C2-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-H1-35-C2-R0 Atribi pwodwi yo

Nimewo Pati : ATS-H1-35-C2-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : HEATSINK 36.83X57.6X5.84MM T766
Seri : pushPIN™
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman : Push Pin
Fòm : Rectangular, Fins
Longè : 1.450" (36.83mm)
Lajè : 2.267" (57.60mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.230" (5.84mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 22.48°C/W @ 100 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Blue Anodized

Ou ka enterese tou
  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-2AB

    Wakefield-Vette

    HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes

  • 122259

    Wakefield-Vette

    HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio

  • TG-CJ-LI-32-32-6-PF

    t-Global Technology

    HEATSINK CER 32X32X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.

  • TG-CJ-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM.