Advanced Thermal Solutions Inc. - ATS-X53230B-C1-R0

KEY Part #: K6264436

ATS-X53230B-C1-R0 Pricing (USD) [6083PC Stock]

  • 1 pcs$6.72067
  • 10 pcs$6.34872
  • 25 pcs$5.97519
  • 50 pcs$5.60165

Nimewo Pati:
ATS-X53230B-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
SUPERGRIP HEATSINK 23X23X7.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 23x23x7.5mm
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - Pwodwi pou Telefòn, Tèmik - lavabo yo, Fanatik AC, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, DC Fans and Tèmik - Thermoelectric, Peltier Modules ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-X53230B-C1-R0 electronic components. ATS-X53230B-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53230B-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X53230B-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-X53230B-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : SUPERGRIP HEATSINK 23X23X7.5MM
Seri : superGRIP™
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Fins
Longè : 0.900" (23.00mm)
Lajè : 0.906" (23.01mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.295" (7.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 16.80°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Blue Anodized

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