ATS-56009-C4-R0 Pricing (USD) [7433PC Stock]
- 1 pcs$4.95787
- 10 pcs$4.68376
- 25 pcs$4.40841
- 50 pcs$4.13280
- 100 pcs$3.85731
- 250 pcs$3.58178
- 500 pcs$3.51290
- 1,000 pcs$3.44402
- Nimewo Pati:
- ATS-56009-C4-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEAT SINK 58MM X 30MM X 9MM. Heat Sinks maxiFLOW BGA ASIC Cooling Heatsink, High Performance, No TIM, 58x30x9mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, Fanatik AC, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - lavabo yo, Fanatik - Pwodwi pou Telefòn, DC Fans, Tèmik - Kousinen, Dra and Tèmik - Pwodwi pou Telefòn ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-56009-C4-R0 electronic components. ATS-56009-C4-R0 can be shipped within 24 hours after order. If you have any demands for ATS-56009-C4-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-56009-C4-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-56009-C4-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEAT SINK 58MM X 30MM X 9MM
Seri :
maxiFLOW
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
ASIC
Metòd Atachman :
Thermal Tape, Adhesive (Not Included)
Fòm :
Rectangular, Angled Fins
Longè :
1.181" (30.00mm)
Lajè :
2.283" (58.00mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.354" (9.00mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
4.80°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-1AB
Wakefield-Vette
HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes
-
392-300AB
Wakefield-Vette
HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm
-
Pati cho
- EX457014CB
- 300872
- DV-T263-301E
- 565416-01
- 565414-01
- 565019-01
- DA-T263-201E
- 3-1542011-8
- 4-1542005-3
- 833302B02800
- 821202B00000
- 833900T00000
- 833702T00000
- MHSL15040
- MHSL10025
- MHSL10055
- 624-35ABT4
- 624-25ABT4
- 7-320-BA
- PSC2-2U
- 7-443-01E-BA
- 7-322-BA
- AQP-HS-N40
- 2-1963558-7
- 2-1963557-7
- 2-1963562-5
- 2-1963564-7
- 2-1963558-4
- 1-1963557-4
- 3-1542012-3
- 1-1963563-2
- 2-1963560-2
- 1-1963560-5
- 1-1963560-2
- 2-1963558-3
- 1-1963557-3
- 2-1963553-3
- 39880100060
- 7-1542006-0
- 6-1542001-0