228-7474-55-1902 Pricing (USD) [2239PC Stock]
- 1 pcs$18.42081
- 10 pcs$16.62691
- 25 pcs$15.93011
- 50 pcs$14.93448
- 100 pcs$14.43666
- 250 pcs$13.64016
- Nimewo Pati:
- 228-7474-55-1902
- Manifakti:
- 3M
- Detaye deskripsyon:
- CONN SOCKET SOIC 28POS GOLD. IC & Component Sockets BURN-IN SOIC SOCKET 28 Leads
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konèkteur Backplane - Espesyalize, Tèminal - Fil Koneksyon Connector, Konektè Fib optik - Cartes, USB, DVI, koneksyon HDMI, Kat Edge Connectors - adapters, Konnektè Konnen - Pwodwi pou Telefòn, Konektè rektangilè - Kontak and Tèminal - Fil Pin Konektè ...
- Avantaj konpetitif:
- We specialize in 3M 228-7474-55-1902 electronic components. 228-7474-55-1902 can be shipped within 24 hours after order. If you have any demands for 228-7474-55-1902, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
228-7474-55-1902 Atribi pwodwi yo
Nimewo Pati :
228-7474-55-1902
Manifakti :
3M
Deskripsyon :
CONN SOCKET SOIC 28POS GOLD
Seri :
Textool™
Estati Pati :
Active
Kalite :
SOIC
Nimewo nan pozisyon oswa Pins (gri) :
28 (2 x 14)
Pitch - kwazman :
-
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
-
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
-
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
30.0µin (0.76µm)
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Polyethersulfone (PES), Glass Filled
Operating Tanperati :
-55°C ~ 150°C
Dènye nouvèl
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