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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 36-3570-11

Aries Electronics - 36-3570-11

KEY Part #: K3349294

36-3570-11 Pricing (USD) [4634PC Stock]

  • 1 pcs$9.39381
  • 4 pcs$9.34708
Nimewo Pati:
36-3570-11
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET ZIF 36POS GLD. IC & Component Sockets QUICK RELEASE 36 PIN GOLD
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Barik - Pouvwa Konektè, Konèkteur Backplane - ARINC, Sockets pou ICS, Transistors, Kontak - Multi Bi, Tèminal - Konektè Fil Splice, Konèkteur Backplane - Hard metrik, Creole, Konektè rektangilè - Housings and Tèminal - Soude Lug konektè ...
Avantaj konpetitif:
We specialize in Aries Electronics 36-3570-11 electronic components. 36-3570-11 can be shipped within 24 hours after order. If you have any demands for 36-3570-11, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

36-3570-11 Atribi pwodwi yo

Nimewo Pati : 36-3570-11
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET ZIF 36POS GLD
Seri : 57
Estati Pati : Active
Kalite : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 36 (2 x 18)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Beryllium Copper
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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