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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 550-10-360M19-001166

Preci-Dip - 550-10-360M19-001166

KEY Part #: K3342929

550-10-360M19-001166 Pricing (USD) [1309PC Stock]

  • 1 pcs$33.22419
  • 19 pcs$33.05889
Nimewo Pati:
550-10-360M19-001166
Manifakti:
Preci-Dip
Detaye deskripsyon:
BGA PIN ADAPTER 1.27MM SMD. IC & Component Sockets
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèminal blòk - Mount Mount, Sikilè Konektè - devèsman ak kranpon kab, Tèminal blòk - Pwodwi pou Telefòn - Fil fè, Kowaksyal Connector (RF) - Terminators, Pouvwa Connectors Antre - Pwodwi pou Telefòn, Konèkteur Backplane - Kontak, Konèkteur Backplane - Hard metrik, Creole and FFC, FPC (Flat Flexible) Connectors ...
Avantaj konpetitif:
We specialize in Preci-Dip 550-10-360M19-001166 electronic components. 550-10-360M19-001166 can be shipped within 24 hours after order. If you have any demands for 550-10-360M19-001166, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

550-10-360M19-001166 Atribi pwodwi yo

Nimewo Pati : 550-10-360M19-001166
Manifakti : Preci-Dip
Deskripsyon : BGA PIN ADAPTER 1.27MM SMD
Seri : 550
Estati Pati : Active
Kalite : BGA
Nimewo nan pozisyon oswa Pins (gri) : 360 (19 x 19)
Pitch - kwazman : 0.050" (1.27mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : FR4 Epoxy Glass
Operating Tanperati : -55°C ~ 125°C
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