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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
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  5. GPEMI1.0-0.125-01-0816

Bergquist - GPEMI1.0-0.125-01-0816

KEY Part #: K6149324

GPEMI1.0-0.125-01-0816 Pricing (USD) [360PC Stock]

  • 1 pcs$128.66044
  • 10 pcs$121.09157
Nimewo Pati:
GPEMI1.0-0.125-01-0816
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 406.4MMX203.2MM BLACK. Thermal Interface Products BERGQUIST GAP PAD TGP EMI1000
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik AC, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Kousinen, Dra, Tèmik - Likid Refwadisman, Tèmik - lavabo yo, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - adezif, epoksi, grès, kole and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist GPEMI1.0-0.125-01-0816 electronic components. GPEMI1.0-0.125-01-0816 can be shipped within 24 hours after order. If you have any demands for GPEMI1.0-0.125-01-0816, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GPEMI1.0-0.125-01-0816 Atribi pwodwi yo

Nimewo Pati : GPEMI1.0-0.125-01-0816
Manifakti : Bergquist
Deskripsyon : THERM PAD 406.4MMX203.2MM BLACK
Seri : Gap Pad® EMI 1.0
Estati Pati : Active
Itilizasyon : -
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 406.40mm x 203.20mm
Pesè : 0.125" (3.18mm)
Materyèl : -
Adezif : Tacky - One Side
Fè bak, Carrier : Fiberglass
Koulè : Black
Rezistivite tèmik : -
Konductivite tèmik : 1.0 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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