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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Fanatik, tèmik Jesyon
  4. Tèmik - Kousinen, Dra
  5. BP100-0.011-00-1010

Bergquist - BP100-0.011-00-1010

KEY Part #: K6149273

BP100-0.011-00-1010 Pricing (USD) [4999PC Stock]

  • 1 pcs$8.66371
  • 10 pcs$7.75632
  • 50 pcs$7.27155
  • 100 pcs$6.78678
  • 500 pcs$6.30201
Nimewo Pati:
BP100-0.011-00-1010
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 254MMX254MM W/ADH WHT.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: DC Fans, Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - Thermoelectric, Peltier Modules ...
Avantaj konpetitif:
We specialize in Bergquist BP100-0.011-00-1010 electronic components. BP100-0.011-00-1010 can be shipped within 24 hours after order. If you have any demands for BP100-0.011-00-1010, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BP100-0.011-00-1010 Atribi pwodwi yo

Nimewo Pati : BP100-0.011-00-1010
Manifakti : Bergquist
Deskripsyon : THERM PAD 254MMX254MM W/ADH WHT
Seri : Bond-Ply® 100
Estati Pati : Active
Itilizasyon : -
Kalite : Sheet, Tape
Fòm : Square
Deskripsyon : 254.00mm x 254.00mm
Pesè : 0.0110" (0.279mm)
Materyèl : Polyimide
Adezif : Adhesive - Both Sides
Fè bak, Carrier : Fiberglass
Koulè : White
Rezistivite tèmik : 1.01°C/W
Konductivite tèmik : 0.8 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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