Nimewo Pati :
RASWLF.031 .7OZ
Manifakti :
Chip Quik Inc.
Deskripsyon :
LF SOLDER WIRE POCKET PACK 96.5/
Konpozisyon :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Pwen fizyon :
422 ~ 428°F (217 ~ 220°C)
Kalite Flux :
Rosin Activated (RA)
Fil Kalib :
21 AWG, 20 SWG
Fòm :
Tube, 0.7 oz (19.85g)
Tanperati Depo / Refrijerasyon :
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