ATS-EXL66-300-R0 Pricing (USD) [10786PC Stock]
- 1 pcs$3.59171
- 10 pcs$3.49299
- 25 pcs$3.29908
- 50 pcs$3.10508
- 100 pcs$2.91100
- 250 pcs$2.71693
- 500 pcs$2.52287
- 1,000 pcs$2.47435
- Nimewo Pati:
- ATS-EXL66-300-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEATSINK AL6063 300X25.4X4MM. Heat Sinks Extrusion Profile, AL6063, Length 300mm, Width 25.4mm, Height 4mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - lavabo yo, DC Fans, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tiyo Chalè, Cham vapè and Tèmik - adezif, epoksi, grès, kole ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-EXL66-300-R0 electronic components. ATS-EXL66-300-R0 can be shipped within 24 hours after order. If you have any demands for ATS-EXL66-300-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-EXL66-300-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-EXL66-300-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEATSINK AL6063 300X25.4X4MM
Seri :
-
Estati Pati :
Active
Kalite :
Top Mount, Extrusion
Pake refwadi :
-
Metòd Atachman :
Adhesive
Fòm :
Rectangular, Fins
Longè :
11.811" (300.00mm)
Lajè :
1.000" (25.40mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.157" (4.00mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
24.80°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
55.00°C/W
Materyèl :
Aluminum
Materyèl Fini :
Degreased
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-1AB
Wakefield-Vette
HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes
-
392-300AB
Wakefield-Vette
HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm
-
Pati cho
- 565421-01
- 565415-01
- DV-T268-301E
- 9-1542003-8
- 8-1542003-3
- 1-1542012-7
- 4-1542005-6
- 832700T00000
- 833202B00000
- 8256BPT00000
- 412310B02500
- 821102B04000
- 825802B05300
- TXBF-019-025U
- APR33-33-12CB
- APR27-27-12CB/M
- PSE1-2CB
- 7-362-BA
- 518-95AB-MS4
- 658-60ABT1
- 658-45ABT4
- 637-10ABP
- UP10-TO3-2CB
- 1542335-3
- 2-1963561-7
- FHS-A9020S01
- 2-1963561-2
- 2-1963559-2
- 1-1963556-7
- 1-1963564-7
- 1-1963558-2
- 2-1963552-2
- 2-1963560-5
- 2-1963555-4
- 1-1963558-3
- 2-1963552-5
- 1542548-2
- 39880100030
- 1542319-2
- 1542284-2