[6033PC Stock]
- Nimewo Pati:
- SIP1X02-041BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN SOCKET SIP 2POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèminal blòk - Pwodwi pou Telefòn, Modilè Konektè - ploge, Terminals - Pwodwi pou Telefòn, Tèminal blòk - Espesyalize, Konektè devwa lou - Asanble yo, D-Sub, D-ki gen fòm Connectors - backshells, Hoods, Konektè rektangilè - Cartes and Solid Eta Lighting Connectors ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) SIP1X02-041BLF electronic components. SIP1X02-041BLF can be shipped within 24 hours after order. If you have any demands for SIP1X02-041BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SIP1X02-041BLF Atribi pwodwi yo
Nimewo Pati :
SIP1X02-041BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN SOCKET SIP 2POS GOLD
Seri :
SIP1x
Estati Pati :
Obsolete
Kalite :
SIP
Nimewo nan pozisyon oswa Pins (gri) :
2 (1 x 2)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
30.0µin (0.76µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati :
-
Dènye nouvèl
Ou ka enterese tou
-
210-13-964-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 64POS GOLD. IC & Component Sockets 64P DIP SKT SOLDER TAIL
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