[5474PC Stock]
- Nimewo Pati:
- SIP1X13-011BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN SOCKET SIP 13POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konektè rektangilè - Prentan ki chaje, Kalite Connectors Pouvwa Kalite - Kontak, D-Sub, D-ki gen fòm Connectors - Pwodwi pou Telefò, Konektè devwa lou - Insérer, Modil yo, Konektè rektangilè - Housings, D-Sub, D-ki gen fòm Connectors - adapters, Konèkteur Backplane - ARINC and Keystone - Inséré ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) SIP1X13-011BLF electronic components. SIP1X13-011BLF can be shipped within 24 hours after order. If you have any demands for SIP1X13-011BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SIP1X13-011BLF Atribi pwodwi yo
Nimewo Pati :
SIP1X13-011BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN SOCKET SIP 13POS GOLD
Seri :
SIP1x
Estati Pati :
Obsolete
Kalite :
SIP
Nimewo nan pozisyon oswa Pins (gri) :
13 (1 x 13)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati :
-
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