ATS-53170D-C1-R0 Pricing (USD) [9741PC Stock]
- 1 pcs$3.79002
- 10 pcs$3.68557
- 25 pcs$3.48082
- 50 pcs$3.27599
- 100 pcs$3.07124
- 250 pcs$2.86649
- 500 pcs$2.66174
- 1,000 pcs$2.61055
- Nimewo Pati:
- ATS-53170D-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEAT SINK 17MM X 17MM X 9.5MM. Heat Sinks maxiGRIP BGA Heatsink with Attachment, High Performance, Straight Fin, Low Profile, Black-Anodized, T766, 17x17x9.5mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn, Fanatik AC, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Kousinen, Dra, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - lavabo yo ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-53170D-C1-R0 electronic components. ATS-53170D-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-53170D-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-53170D-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-53170D-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEAT SINK 17MM X 17MM X 9.5MM
Seri :
maxiGRIP
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Fins
Longè :
0.669" (17.00mm)
Lajè :
0.669" (17.00mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.374" (9.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
24.30°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
Pati cho
- LATO3B4B
- 565415-01
- 565019-01
- FEX35-35-21/T710/M2
- DA-T268-301E
- 4-1542005-5
- 7-1542004-0
- 8-1542003-7
- 574802B03700G
- VHS-95
- MHST02525
- MHSL05025
- MHSL05040
- APR38-38-12CB
- 7-438-X44-BA
- 243-3PAB
- LA363B5CB
- LA363B4CB
- 7-406-000-BA
- 7-300-000-BA
- 7-192-BA
- 2-1963559-7
- 2-1963562-3
- 2-1963556-7
- 2-1963559-2
- 1-1963558-2
- 2-1963555-2
- 1-1963555-2
- 2-1963557-5
- 1-1963559-5
- 2-1963553-4
- 2-1963555-3
- 2-1963551-3
- 1-1963553-3
- 5-1542006-7
- 39880100030
- 39880100110
- 39880100060
- 39880100040
- 7-1542006-0