HDAF-23-18.0-S-13-1 Pricing (USD) [2365PC Stock]
- 1 pcs$18.31425
- Nimewo Pati:
- HDAF-23-18.0-S-13-1
- Manifakti:
- Samtec Inc.
- Detaye deskripsyon:
- CONN HD ARRAY 299POS FEMALE GOLD. Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konèkteur Backplane - DIN 41612, Konèkteur Backplane - ARINC Insérer, Tèminal - Soude Lug konektè, Tèminal blòk - Din Rail, Chèn, Konnektè Konnen, Barik - Pouvwa Konektè, Konnektè memwa - Pwodwi pou Telefòn and Konektè rektangilè - bag Komisyon Konsèy, anpileur ...
- Avantaj konpetitif:
- We specialize in Samtec Inc. HDAF-23-18.0-S-13-1 electronic components. HDAF-23-18.0-S-13-1 can be shipped within 24 hours after order. If you have any demands for HDAF-23-18.0-S-13-1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HDAF-23-18.0-S-13-1 Atribi pwodwi yo
Nimewo Pati :
HDAF-23-18.0-S-13-1
Manifakti :
Samtec Inc.
Deskripsyon :
CONN HD ARRAY 299POS FEMALE GOLD
Seri :
HD Mezz™ HDAF
Estati Pati :
Active
Kalite Connector :
High Density Array, Female
Kantite Pozisyon yo :
299
Goudwon :
0.047" (1.20mm)
Kantite ranje yo :
13
Mounting Kalite :
Surface Mount
Karakteristik :
Board Guide
Kontakte Fini :
Gold
Kontakte fini epesè :
30.0µin (0.76µm)
Konnen anpile Heights :
30mm, 35mm
Wotè Pi wo pase Komisyon Konsèy la :
0.807" (20.51mm)
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