Nimewo Pati :
APF19-19-13CB/A01
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK FORGED W/ADHESIVE TAPE
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Wotè Off Sèvi (Tay nan Fin) :
0.500" (12.70mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
4.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl Fini :
Black Anodized