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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Fanatik, tèmik Jesyon
  4. Tèmik - Kousinen, Dra
  5. HF115AC-0.0055-AC-90

Bergquist - HF115AC-0.0055-AC-90

KEY Part #: K6153326

HF115AC-0.0055-AC-90 Pricing (USD) [935213PC Stock]

  • 1 pcs$0.03955
  • 10 pcs$0.03441
  • 50 pcs$0.03085
  • 100 pcs$0.02729
  • 500 pcs$0.02373
  • 1,000 pcs$0.01780
  • 5,000 pcs$0.01542
Nimewo Pati:
HF115AC-0.0055-AC-90
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 21.84MMX18.79MM W/ADH.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik AC, DC Fans, Tèmik - lavabo yo, Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra and Tèmik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist HF115AC-0.0055-AC-90 electronic components. HF115AC-0.0055-AC-90 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-90, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HF115AC-0.0055-AC-90 Atribi pwodwi yo

Nimewo Pati : HF115AC-0.0055-AC-90
Manifakti : Bergquist
Deskripsyon : THERM PAD 21.84MMX18.79MM W/ADH
Seri : Hi-Flow® 115-AC
Estati Pati : Active
Itilizasyon : TO-218, TO-220, TO-247
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 21.84mm x 18.79mm
Pesè : 0.0055" (0.140mm)
Materyèl : Phase Change Compound
Adezif : Adhesive - One Side
Fè bak, Carrier : Fiberglass
Koulè : Gray
Rezistivite tèmik : 0.35°C/W
Konductivite tèmik : 0.8 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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