Bergquist - Q3-0.005-00-11

KEY Part #: K6153734

Q3-0.005-00-11 Pricing (USD) [1870428PC Stock]

  • 1 pcs$0.03100
  • 4,900 pcs$0.03085

Nimewo Pati:
Q3-0.005-00-11
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 33.32MMX19.35MM BLACK. Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Series
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Fanatik AC, Tèmik - tiyo Chalè, Cham vapè, Fanatik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, DC Fans, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - Kousinen, Dra ...
Avantaj konpetitif:
We specialize in Bergquist Q3-0.005-00-11 electronic components. Q3-0.005-00-11 can be shipped within 24 hours after order. If you have any demands for Q3-0.005-00-11, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

Q3-0.005-00-11 Atribi pwodwi yo

Nimewo Pati : Q3-0.005-00-11
Manifakti : Bergquist
Deskripsyon : THERM PAD 33.32MMX19.35MM BLACK
Seri : Q-Pad® 3
Estati Pati : Active
Itilizasyon : TO-66
Kalite : Pad, Sheet
Fòm : Rhombus
Deskripsyon : 33.32mm x 19.35mm
Pesè : 0.0050" (0.127mm)
Materyèl : Elastomer
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : Black
Rezistivite tèmik : 0.35°C/W
Konductivite tèmik : 2.0 W/m-K

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