Apex Microtechnology - HS03

KEY Part #: K6263638

HS03 Pricing (USD) [1519PC Stock]

  • 1 pcs$28.51148
  • 10 pcs$26.83434
  • 25 pcs$25.15719
  • 50 pcs$23.48004
  • 100 pcs$22.64147

Nimewo Pati:
HS03
Manifakti:
Apex Microtechnology
Detaye deskripsyon:
HEATSINK 8P TO-3 1.7C/W.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Kousinen, Dra and Tèmik - Likid Refwadisman ...
Avantaj konpetitif:
We specialize in Apex Microtechnology HS03 electronic components. HS03 can be shipped within 24 hours after order. If you have any demands for HS03, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HS03 Atribi pwodwi yo

Nimewo Pati : HS03
Manifakti : Apex Microtechnology
Deskripsyon : HEATSINK 8P TO-3 1.7C/W
Seri : Apex Precision Power®
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Rectangular, Fins
Longè : 3.000" (76.20mm)
Lajè : 4.750" (120.65mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.250" (31.75mm)
Disipasyon pouvwa @ monte tanperati : 15.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 1.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 1.70°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Ou ka enterese tou
  • 512-12M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x304.8mm

  • 511-9U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x228.6mm

  • 511-9M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks H/S 5.21 X 9.00"

  • 511-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm

  • 511-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x152.4mm

  • 511-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm