[3922PC Stock]
- Nimewo Pati:
- AR08-HZL/07-TT
- Manifakti:
- Assmann WSW Components
- Detaye deskripsyon:
- CONN IC DIP SOCKET 8POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Kalite Connectors Pouvwa Kalite - Pwodwi pou Telef, USB, DVI, koneksyon HDMI, Tèminal blòk - Espesyalize, Kat Edge Connectors - Kontak, Konèkteur Backplane - Pwodwi pou Telefòn, Tèminal blòk - Cartes, Modular Connectors - Plug Housings and Modular Connectors - Jacks Avèk Magnetics ...
- Avantaj konpetitif:
- We specialize in Assmann WSW Components AR08-HZL/07-TT electronic components. AR08-HZL/07-TT can be shipped within 24 hours after order. If you have any demands for AR08-HZL/07-TT, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
AR08-HZL/07-TT Atribi pwodwi yo
Nimewo Pati :
AR08-HZL/07-TT
Manifakti :
Assmann WSW Components
Deskripsyon :
CONN IC DIP SOCKET 8POS GOLD
Seri :
-
Estati Pati :
Obsolete
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
8 (2 x 4)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
30.0µin (0.76µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Thermoplastic, Polyester
Operating Tanperati :
-40°C ~ 105°C
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