Nimewo Pati :
SMDLTLFP10T4
Manifakti :
Chip Quik Inc.
Deskripsyon :
SOLDER PASTE LOW TEMP T4 10CC
Konpozisyon :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Pwen fizyon :
281°F (138°C)
Fòm :
Syringe, 1.23 oz (35g), 10cc
Lavi etajè :
6 Months, 2 Months
Lavi etajè kòmanse :
Date of Manufacture
Tanperati Depo / Refrijerasyon :
37°F ~ 46°F (3°C ~ 8°C)