Aavid, Thermal Division of Boyd Corporation - 501503B00000G

KEY Part #: K6265655

501503B00000G Pricing (USD) [74221PC Stock]

  • 1 pcs$0.52262
  • 10 pcs$0.49628
  • 25 pcs$0.48332
  • 50 pcs$0.47028
  • 100 pcs$0.44415
  • 250 pcs$0.41802
  • 500 pcs$0.39189
  • 1,000 pcs$0.34600
  • 5,000 pcs$0.33364

Nimewo Pati:
501503B00000G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEATSINK TO-3 1.00 BLK. Heat Sinks Diamond Shaped Basket Stamped Heatsink for TO-3, Low-Cost, Horizontal Mounting, 8.4 n Thermal Resistance, Black Anodized, 25.4mm
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra, Tèmik - lavabo yo, Tèmik - tiyo Chalè, Cham vapè, Fanatik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Thermoelectric, Peltier Modules and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 501503B00000G electronic components. 501503B00000G can be shipped within 24 hours after order. If you have any demands for 501503B00000G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

501503B00000G Atribi pwodwi yo

Nimewo Pati : 501503B00000G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK TO-3 1.00 BLK
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Rhombus
Longè : 1.880" (47.75mm)
Lajè : 1.400" (35.56mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.000" (25.40mm)
Disipasyon pouvwa @ monte tanperati : 5.0W @ 40°C
Rezistans tèmik @ fòse Air koule : 2.00°C/W @ 500 LFM
Rezistans tèmik @ natirèl : 8.40°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Ou ka enterese tou
  • D10650-40

    Wakefield-Vette

    HEATSINK 100PQFP COMPOSITE. Heat Sinks Deltem Composite Pin Fin Heatsink, 16.5x10.2mm

  • 658-60ABT3

    Wakefield-Vette

    HEATSINK CPU 28MM SQ BLK W/TAPE. Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412

  • 658-35AB

    Wakefield-Vette

    HEATSINK CPU 28MM SQBLK W/O TAPE. Heat Sinks HEAT SINK 28MM OMNIDIRECTIONAL

  • 655-53AB

    Wakefield-Vette

    HEATSINK CPU 40.6MM SQ H.525. Heat Sinks HEATSINK

  • 628-65AB

    Wakefield-Vette

    HEATSINK CPU 43MM SQ BLK H.65. Heat Sinks HEATSINK

  • 625-45AB

    Wakefield-Vette

    HEATSINK CPU 25MM SQ H.45 BLK. Heat Sinks HEATSINK