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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 551002B00000G

Aavid, Thermal Division of Boyd Corporation - 551002B00000G

KEY Part #: K6265526

551002B00000G Pricing (USD) [74816PC Stock]

  • 1 pcs$0.25312
  • 10 pcs$0.24284
  • 25 pcs$0.23081
  • 50 pcs$0.22472
  • 100 pcs$0.22164
  • 250 pcs$0.20647
  • 500 pcs$0.19432
  • 1,000 pcs$0.17611
  • 5,000 pcs$0.17004
Nimewo Pati:
551002B00000G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEATSINK TO-220 1.45 HIGH.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, DC Fans, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn, Tèmik - Likid Refwadisman and Fanatik - Pwodwi pou Telefòn - Fil Fan ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 551002B00000G electronic components. 551002B00000G can be shipped within 24 hours after order. If you have any demands for 551002B00000G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

551002B00000G Atribi pwodwi yo

Nimewo Pati : 551002B00000G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK TO-220 1.45 HIGH
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-220
Metòd Atachman : Bolt On
Fòm : Rectangular, Fins
Longè : 1.450" (36.83mm)
Lajè : 1.006" (25.55mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.787" (19.99mm)
Disipasyon pouvwa @ monte tanperati : 1.5W @ 20°C
Rezistans tèmik @ fòse Air koule : 4.00°C/W @ 300 LFM
Rezistans tèmik @ natirèl : 12.40°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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