BGM13HBA9E6327XTSA1 Pricing (USD) [321466PC Stock]
- 1 pcs$0.11563
- 4,500 pcs$0.11506
- Nimewo Pati:
- BGM13HBA9E6327XTSA1
- Manifakti:
- Infineon Technologies
- Detaye deskripsyon:
- MULTI CHIP MODULES.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: RFID, RF Aksè, Siveyans ICs, RFI ak EMI - Kontak, Fingerstock ak jwen, RF Receiver, emetris, ak resèpteur finn inite yo, RF diplexèks, RF Transmetè, Balun, RF Anplifikatè and Transpondè RFID, Tags ...
- Avantaj konpetitif:
- We specialize in Infineon Technologies BGM13HBA9E6327XTSA1 electronic components. BGM13HBA9E6327XTSA1 can be shipped within 24 hours after order. If you have any demands for BGM13HBA9E6327XTSA1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BGM13HBA9E6327XTSA1 Atribi pwodwi yo
Nimewo Pati :
BGM13HBA9E6327XTSA1
Manifakti :
Infineon Technologies
Deskripsyon :
MULTI CHIP MODULES
Seri :
-
Estati Pati :
Active
RF Fanmi / Creole :
Bluetooth
Pwotokòl :
802.11a/b/g/n, Bluetooth v4.0
Modilasyon :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frekans :
1.805GHz ~ 2.69GHz
To Done :
54Mbps
Pouvwa - Sòti :
-
Sansiblite :
-
Interfaces seri :
SPI, USB
Kalite Antèn :
-
Itilize IC / Pati :
-
Size memwa :
-
Voltage - Pwovizyon pou :
1.6V ~ 3.1V
Kouran - Resevwa :
-
Kouran - transmèt :
-
Mounting Kalite :
Surface Mount
Operating Tanperati :
-40°C ~ 85°C
Pake / Ka :
-
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