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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 374324B60023G

Aavid, Thermal Division of Boyd Corporation - 374324B60023G

KEY Part #: K6264871

374324B60023G Pricing (USD) [14750PC Stock]

  • 1 pcs$2.79404
Nimewo Pati:
374324B60023G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
BGA HEAT SINK. Heat Sinks BGA Solder Anchor, 27x27x10mm, Black Anodized, 2 Anchors, IC Pkg Size = 27 x 27
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Fanatik - Pwodwi pou Telefòn, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan, DC Fans and Tèmik - tèrmoelèktrik, asanble Peltier ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 374324B60023G electronic components. 374324B60023G can be shipped within 24 hours after order. If you have any demands for 374324B60023G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

374324B60023G Atribi pwodwi yo

Nimewo Pati : 374324B60023G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : BGA HEAT SINK
Seri : -
Estati Pati : Active
Kalite : -
Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman : Solder Anchor
Fòm : -
Longè : -
Lajè : -
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.390" (9.91mm)
Disipasyon pouvwa @ monte tanperati : 1.5W @ 50°C
Rezistans tèmik @ fòse Air koule : 6.00°C/W @ 500 LFM
Rezistans tèmik @ natirèl : 30.60°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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