Nimewo Pati :
B39881B9844P810
Manifakti :
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Aplikasyon :
Cellular, LTE
Mounting Kalite :
Surface Mount
Pake / Ka :
10-SMD, No Lead
Wotè (Max) :
0.018" (0.45mm)
Size / dimansyon :
0.067" L x 0.051" W (1.70mm x 1.30mm)