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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Fanatik, tèmik Jesyon
  4. Tèmik - lavabo yo
  5. 7023B-MTG

Aavid, Thermal Division of Boyd Corporation - 7023B-MTG

KEY Part #: K6265524

7023B-MTG Pricing (USD) [70849PC Stock]

  • 1 pcs$0.56025
  • 10 pcs$0.53224
  • 25 pcs$0.51811
  • 50 pcs$0.50406
  • 100 pcs$0.47609
  • 250 pcs$0.44809
  • 500 pcs$0.42008
  • 1,000 pcs$0.39207
  • 5,000 pcs$0.37807
Nimewo Pati:
7023B-MTG
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
BOARD LEVEL HEATSINK 1.95 TO220. Heat Sinks Channel Style Stamped Heatsink for TO-220, Folded Back Fins, Vertical Mounting, 4.4 n Thermal Resistance, 2.90mm Hole
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - tiyo Chalè, Cham vapè, DC Fans, Fanatik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Thermoelectric, Peltier Modules and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 7023B-MTG electronic components. 7023B-MTG can be shipped within 24 hours after order. If you have any demands for 7023B-MTG, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

7023B-MTG Atribi pwodwi yo

Nimewo Pati : 7023B-MTG
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : BOARD LEVEL HEATSINK 1.95 TO220
Seri : -
Estati Pati : Active
Kalite : Board Level, Vertical
Pake refwadi : TO-220
Metòd Atachman : Bolt On and PC Pin
Fòm : Rectangular, Fins
Longè : 1.950" (49.53mm)
Lajè : 1.900" (48.26mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.950" (24.13mm)
Disipasyon pouvwa @ monte tanperati : 3.0W @ 20°C
Rezistans tèmik @ fòse Air koule : 2.50°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 4.40°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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