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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 30-1518-00

Aries Electronics - 30-1518-00

KEY Part #: K3358878

30-1518-00 Pricing (USD) [16101PC Stock]

  • 1 pcs$2.57233
  • 19 pcs$2.55954
Nimewo Pati:
30-1518-00
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET 30POS GOLD. IC & Component Sockets SURFACE MOUNT COLLET DUAL ROW 30 PINS
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konèkteur Backplane - ARINC Insérer, Memwa Connectors - Inline Module Sockets, Konektè devwa lou - Asanble yo, Konèkteur Backplane - Housings, Modilè Konektè - Pwodwi pou Telefòn, Konnektè Konnen, Terminals - PC Pin, Single Post Connectors and Konnektè memwa - Kat PC Sockets ...
Avantaj konpetitif:
We specialize in Aries Electronics 30-1518-00 electronic components. 30-1518-00 can be shipped within 24 hours after order. If you have any demands for 30-1518-00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

30-1518-00 Atribi pwodwi yo

Nimewo Pati : 30-1518-00
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET 30POS GOLD
Seri : 518
Estati Pati : Active
Kalite : DIP, 0.2" (5.08mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 30 (2 x 15)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Open Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Tanperati : -
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