[6973PC Stock]
- Nimewo Pati:
- D0818-01
- Manifakti:
- Harwin Inc.
- Detaye deskripsyon:
- CONN IC DIP SOCKET 18POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Bannann ak Tip Connectors - krik, ploge, Konèkteur Backplane - ARINC, Konektè rektangilè - Housings, Konektè Fib optik - Cartes, Konektè rektangilè - Gratis Pandye, Mount Mount, Kalite Konnektè Power Connection - Housings, Keystone - Faceplates, kadr and Memwa Connectors - Inline Module Sockets ...
- Avantaj konpetitif:
- We specialize in Harwin Inc. D0818-01 electronic components. D0818-01 can be shipped within 24 hours after order. If you have any demands for D0818-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
D0818-01 Atribi pwodwi yo
Nimewo Pati :
D0818-01
Manifakti :
Harwin Inc.
Deskripsyon :
CONN IC DIP SOCKET 18POS GOLD
Seri :
D0
Estati Pati :
Obsolete
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
18 (2 x 9)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Wire Wrap
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
196.9µin (5.00µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Operating Tanperati :
-55°C ~ 125°C
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