ATS-51230D-C1-R0 Pricing (USD) [8635PC Stock]
- 1 pcs$4.27479
- 10 pcs$4.15800
- 25 pcs$3.92717
- 50 pcs$3.69615
- 100 pcs$3.46518
- 250 pcs$3.23416
- 500 pcs$3.00314
- 1,000 pcs$2.94538
- Nimewo Pati:
- ATS-51230D-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEAT SINK 23MM X 23MM X 9.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 23x23x9.5mm, 37.5mm Fin Tip
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, DC Fans, Fanatik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn and Tèmik - adezif, epoksi, grès, kole ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-51230D-C1-R0 electronic components. ATS-51230D-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-51230D-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-51230D-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-51230D-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEAT SINK 23MM X 23MM X 9.5MM
Seri :
maxiGRIP, maxiFLOW
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Angled Fins
Longè :
0.900" (23.00mm)
Lajè :
0.906" (23.01mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.374" (9.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
11.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
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