ATS-59009-C1-R0 Pricing (USD) [4005PC Stock]
- 1 pcs$9.17334
- 10 pcs$8.66278
- 25 pcs$7.75561
- 50 pcs$7.27084
- 100 pcs$6.78612
- 250 pcs$6.30138
- 500 pcs$6.18020
- Nimewo Pati:
- ATS-59009-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEAT SINK 62MM X 52MM X 13MM. Heat Sinks maxiGRIP Heatsink Assembly, Double-Sided Adhesive, Black-Anodized, T412, 42.5mm Comp, 62x52x13mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Fanatik AC, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Kousinen, Dra, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - tiyo Chalè, Cham vapè ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-59009-C1-R0 electronic components. ATS-59009-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-59009-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-59009-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-59009-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEAT SINK 62MM X 52MM X 13MM
Seri :
maxiGRIP
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
Flip Chip Processors
Metòd Atachman :
Clip
Fòm :
Rectangular, Fins
Longè :
2.441" (62.00mm)
Lajè :
2.047" (52.00mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.512" (13.00mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
3.20°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
392-300AB
Wakefield-Vette
HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm
-
-
Pati cho
- FXE827269T710
- 565416-01
- 0372501020
- V6534B
- 9-1542004-3
- 5-1542003-0
- 833302B02800
- 821202B00000
- 821702B00000
- TXB2P-032-037ND
- MHSL02525
- 624-35ABT4
- 658-25ABT2
- 658-25ABT1
- 7-335-000-BA
- 7-423-BA
- 7-199-BA
- 7-338-M01-BA
- 7-321-BA
- PSD1-1-CB
- 2-1963561-3
- 1-1963563-5
- 2-1963560-4
- 1-1963560-4
- 1-1963563-3
- 1-1963559-2
- 2-1963552-2
- 1-1963552-2
- 2-1963558-5
- 1-1963564-4
- 2-1963551-2
- 2-1963552-4
- 1-1963552-7
- 1-1963560-3
- 2-1963556-3
- 2-1963551-5
- 1-1963552-3
- 826002B05300
- APR38-38-12CB/T
- 1542295-2