Advanced Thermal Solutions Inc. - ATS-52375P-C1-R0

KEY Part #: K6263808

ATS-52375P-C1-R0 Pricing (USD) [8454PC Stock]

  • 1 pcs$4.14258
  • 10 pcs$4.03020
  • 25 pcs$3.80606
  • 50 pcs$3.58219
  • 100 pcs$3.35835
  • 250 pcs$3.13445
  • 500 pcs$2.91056
  • 1,000 pcs$2.85458

Nimewo Pati:
ATS-52375P-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
HEAT SINK 37.5 X 37.5 X 17.5MM. Heat Sinks maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, T412, 37.5x37.5x17.5mm
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - lavabo yo, Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn and Fanatik AC ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-52375P-C1-R0 electronic components. ATS-52375P-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-52375P-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-52375P-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-52375P-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : HEAT SINK 37.5 X 37.5 X 17.5MM
Seri : maxiFLOW
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Thermal Tape, Adhesive (Included)
Fòm : Square, Angled Fins
Longè : 1.476" (37.50mm)
Lajè : 1.476" (37.50mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.689" (17.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 2.10°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Blue Anodized

Ou ka enterese tou
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3-50.8-12.7-0.21-1A

    t-Global Technology

    PH3 50.8X12.07X0.21MM.

  • PH3-150-150-0.21-1A

    t-Global Technology

    IR HEAT SPREADER/EMITTER W/ADH.