[6497PC Stock]
- Nimewo Pati:
- 824-AG31D
- Manifakti:
- TE Connectivity AMP Connectors
- Detaye deskripsyon:
- CONN IC DIP SOCKET 24POS GOLD. IC & Component Sockets DIP-24 IC SOCKET 1600
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Kat Edge Connectors - Edgeboard Connectors, Kowaksyal Connector (RF), Kalite Connectors Pouvwa Kalite - Kontak, Tèminal blòk - Cartes, Barik - Pouvwa Konektè, Blòk Tèminal - Blòk Baryè, Kowaksyal Connector (RF) - Pwodwi pou Telefòn and Konèkteur Backplane - Housings ...
- Avantaj konpetitif:
- We specialize in TE Connectivity AMP Connectors 824-AG31D electronic components. 824-AG31D can be shipped within 24 hours after order. If you have any demands for 824-AG31D, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
824-AG31D Atribi pwodwi yo
Nimewo Pati :
824-AG31D
Manifakti :
TE Connectivity AMP Connectors
Deskripsyon :
CONN IC DIP SOCKET 24POS GOLD
Seri :
800
Estati Pati :
Obsolete
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
24 (2 x 12)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
25.0µin (0.63µm)
Kontakte materyèl - kwazman :
Copper Alloy
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin-Lead
Kontakte Fini Epesè - Post :
-
Kontakte Materyèl - Post :
Copper Alloy
Materyèl Lojman :
Polyester
Operating Tanperati :
-55°C ~ 105°C
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