t-Global Technology - TG2030-25-25-0.5

KEY Part #: K6153187

TG2030-25-25-0.5 Pricing (USD) [101653PC Stock]

  • 1 pcs$0.38465
  • 10 pcs$0.34567
  • 25 pcs$0.32826
  • 50 pcs$0.31956
  • 100 pcs$0.31529
  • 250 pcs$0.29368
  • 500 pcs$0.27641
  • 1,000 pcs$0.25049
  • 5,000 pcs$0.24186

Nimewo Pati:
TG2030-25-25-0.5
Manifakti:
t-Global Technology
Detaye deskripsyon:
THERM PAD 25MMX25MM WHITE.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra, Tèmik - lavabo yo and Fanatik AC ...
Avantaj konpetitif:
We specialize in t-Global Technology TG2030-25-25-0.5 electronic components. TG2030-25-25-0.5 can be shipped within 24 hours after order. If you have any demands for TG2030-25-25-0.5, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TG2030-25-25-0.5 Atribi pwodwi yo

Nimewo Pati : TG2030-25-25-0.5
Manifakti : t-Global Technology
Deskripsyon : THERM PAD 25MMX25MM WHITE
Seri : TG2030
Estati Pati : Active
Itilizasyon : -
Kalite : Conductive Pad, Sheet
Fòm : Square
Deskripsyon : 25.00mm x 25.00mm
Pesè : 0.0197" (0.500mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : White
Rezistivite tèmik : -
Konductivite tèmik : 2.0 W/m-K

Ou ka enterese tou
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft