Q3-0.005-00-25 Pricing (USD) [1870428PC Stock]
- 1 pcs$0.03100
- 4,900 pcs$0.03085
- Nimewo Pati:
- Q3-0.005-00-25
- Manifakti:
- Bergquist
- Detaye deskripsyon:
- THERM PAD 25.4MMX6.6MM BLACK. Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Series
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik AC, Tèmik - lavabo yo, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules and Tèmik - tiyo Chalè, Cham vapè ...
- Avantaj konpetitif:
- We specialize in Bergquist Q3-0.005-00-25 electronic components. Q3-0.005-00-25 can be shipped within 24 hours after order. If you have any demands for Q3-0.005-00-25, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
Q3-0.005-00-25 Atribi pwodwi yo
Nimewo Pati :
Q3-0.005-00-25
Manifakti :
Bergquist
Deskripsyon :
THERM PAD 25.4MMX6.6MM BLACK
Seri :
Q-Pad® 3
Estati Pati :
Active
Itilizasyon :
DO-5
Kalite :
Pad, Sheet
Fòm :
Round
Deskripsyon :
25.40mm x 6.60mm
Pesè :
0.0050" (0.127mm)
Materyèl :
Elastomer
Adezif :
-
Fè bak, Carrier :
Fiberglass
Koulè :
Black
Rezistivite tèmik :
0.35°C/W
Konductivite tèmik :
2.0 W/m-K
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